RRP Electronics, a player in the semiconductor industry and backed by cricket legend Sachin Tendulkar, has entered into a strategic alliance with US-based Deca Technologies, to enhance its semiconductor capabilities.
Under the alliance, RRP Electronics – a firm focused on assembling and testing semiconductor components – will utilise Deca’s cutting-edge wafer-level packaging solutions to enhance its semiconductor capabilities.
RRP will integrate Deca’s WLCSP and M-Series FOWLP technologies with the company’s assembly and testing processes. Deca, a leading technology development and licensing company in the advanced packaging industry, is backed by major industry investors such as Qualcomm, Infineon, and ASE Group.
Rajendra K Chodankar, Chairman and CEO, RRP Electronics said, “We are prepared to invest in a large-scale Technology Transfer License Agreement (TTLA) with potential exclusive terms for the complete automated infrastructure and take this alliance beyond horizons. The present infrastructure will also significantly contribute to the Deca ecosystem. We envisage the set up functional operations after a qualification test in August 2025. This collaboration has the potential to generate revenue of over USD 30 million (about ₹260 crore) in the second year of operation, with quantum jumps in subsequent years.”
Tim Olson, Founder and CEO of Deca said, “We are excited to be an integral part of India’s exciting journey to become a prominent player in the growing global semiconductor industry. I am deeply impressed by the focus of the RRP Electronics team and believe that the relationship with Deca will accelerate their ambitious plans.”
RRP Electronics is developing an Outsourced Semiconductor Assembly and Test (OSAT) initiative with a total investment of ₹24,000 crore. The OSAT initiative aims to establish a state-of-the-art semiconductor manufacturing and assembly facility in Maharashtra.
